Modified adhesive layers are prepared by contacting an adhesive layer to a modified microstructured release liner. The modified release liner has a release layer surface with a set of microstructured depressions and a discontinuous pattern of ink material located on the surface of the release layer. A portion of the discontinuous pattern of ink material overlaps with and is located within some of the depressions. The ink material comprises a non-adhesive but adhesively transferrable material, or an adhesive material. Upon removal of the adhesive from the release liner, the ink material transfers to the adhesive surface.