Invention Grant
- Patent Title: Semiconductor package structure with antenna
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Application No.: US17361285Application Date: 2021-06-28
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Publication No.: US11574881B2Publication Date: 2023-02-07
- Inventor: Nai-Wei Liu , Yen-Yao Chi , Yeh-Chun Kao , Shih-Huang Yeh , Tzu-Hung Lin , Wen-Sung Hsu
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H01Q1/22 ; H01Q9/04 ; H01Q9/16 ; H01L23/552 ; H01Q1/52
Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.
Public/Granted literature
- US20210327835A1 SEMICONDUCTOR PACKAGE STRUCTURE WITH ANTENNA Public/Granted day:2021-10-21
Information query
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