公开(公告)号：US10277287B2

公开(公告)日：2019-04-30

申请号：US14936976

申请日：2015-11-10

Applicant: MediaTek Inc.

Inventor： Ting-Wei Kang ,  Shih-Huang Yeh

IPC: H04B1/18 ,  H04B1/44 ,  H04B7/04 ,  H04B1/04 ,  H01Q21/28 ,  H01Q5/314 ,  H01Q5/335

Abstract: An antenna system includes an antenna, a first frequency dividing circuit, a second frequency dividing circuit, and a plurality of matching circuits. The first frequency dividing circuit is coupled to the antenna. The matching circuits are coupled to the first frequency dividing circuit. The second frequency dividing circuit is coupled to the matching circuits. The matching circuits are configured to process different frequency signals, respectively.

公开(公告)号：US20180090836A1

公开(公告)日：2018-03-29

申请号：US15620817

申请日：2017-06-12

Applicant: MEDIATEK INC.

Inventor： Wun-Jian Lin ,  Chung-Yu Hung ,  Chen-Fang Tai ,  Shih-Huang Yeh

IPC: H01Q3/16 ,  H01Q1/24

CPC classification number: H01Q3/16 ,  H01Q1/243 ,  H01Q1/245 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q5/335

Abstract: An interface module for a communication device includes a first switch, for forming a first connection between a first feeding point of an antenna of the communication device and one of a first matching component and a first grounding component; a second switch, for forming a second connection between a second feeding point of the antenna and one of a second matching component and a second grounding component; and a third switch, for forming a third connection between a transceiver and one of the first matching component and the first grounding component.

公开(公告)号：US12272887B2

公开(公告)日：2025-04-08

申请号：US18162007

申请日：2023-01-31

Applicant: MEDIATEK INC.

Inventor： Chung-Hsin Chiang ,  Nai-Chen Liu ,  Shih-Huang Yeh

IPC: H01Q9/16 ,  H01Q1/48 ,  H01Q5/335 ,  H01Q21/26

Abstract: An antenna is provided. The antenna includes a first radiator positioned at a first level and connected to a ground plane at a second level. In a top view, the first radiator has a first edge, a second edge, a third edge, a fourth edge and a first arc edge. The second edge and the third edge are connected to opposite ends of the first edge. The fourth edge is connected to an end of the third edge opposite to the first edge. The first arc edge with a first radius has opposite ends respectively connected to the second edge and the fourth edge. The first arc edge has a first arc length corresponding to a first central angle, which is less than 90 degrees.

公开(公告)号：US11937371B2

公开(公告)日：2024-03-19

申请号：US17366468

申请日：2021-07-02

Applicant: MEDIATEK Inc.

Inventor： Wun-Jian Lin ,  Chung-Hsin Chiang ,  Yeh-Chun Kao ,  Shih-Huang Yeh

IPC: H04B1/40 ,  H01Q1/12 ,  H01Q1/22 ,  H05K1/02

CPC classification number: H05K1/028 ,  H01Q1/12 ,  H04B1/40 ,  H05K2201/10098

Abstract: A radio frequency (RF) system and a communication device are provided. The RF system includes a flexible circuit board, a first antenna module and a RF module. The flexible circuit board has a first surface and a second surface, and the first surface and the second surface are located at different sides of the flexible circuit board. The first antenna module is disposed on the first surface of the flexible circuit board. The first antenna module includes a first carrier, a first antenna element disposed on or in the first carrier, and a first conductive member between the first carrier and the flexible circuit board. The RF module is disposed on the second surface of the flexible circuit board and electrically connected to the first antenna module.

公开(公告)号：US11075459B2

公开(公告)日：2021-07-27

申请号：US16745303

申请日：2020-01-16

Applicant: MEDIATEK INC.

Inventor： Shao-Yu Huang ,  Yeh-Chun Kao ,  Chung-Hsin Chiang ,  Shih-Huang Yeh

IPC: H01Q5/385 ,  H01Q9/04 ,  H01Q21/06

Abstract: A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m×n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.

公开(公告)号：US20250167456A1

公开(公告)日：2025-05-22

申请号：US18935630

申请日：2024-11-03

Applicant: MEDIATEK INC.

Inventor： Hsuan-Jui Chang ,  Shih-Huang Yeh ,  Wun-Jian Lin ,  Chih-Hsiang Liu

IPC: H01Q13/18

Abstract: An antenna can include a first wall, a second wall, a third wall, a feed element, and a conductive path. The first wall can have a front side, an upper side, a lower side, a rear side and a first slot. The first slot can have an open end at the front side of the first wall, and a closed end. The second wall can have a front side, an upper side, a lower side, a rear side, and a second slot. The second slot can have an open end at the front side of the second wall, and a closed end. The third wall can be connected to the upper side of the first wall and the upper side of the second wall. The conductive path can have a first terminal coupled to the feed element, and a second terminal coupled to a feed point.

公开(公告)号：US20210327835A1

公开(公告)日：2021-10-21

申请号：US17361285

申请日：2021-06-28

Applicant: MediaTek Inc.

Inventor： Nai-Wei Liu ,  Yen-Yao Chi ,  Yeh-Chun Kao ,  Shih-Huang Yeh ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/16

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

公开(公告)号：US11081453B2

公开(公告)日：2021-08-03

申请号：US16452395

申请日：2019-06-25

Applicant: MediaTek Inc.

Inventor： Nai-Wei Liu ,  Yen-Yao Chi ,  Yeh-Chun Kao ,  Shih-Huang Yeh ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01L23/66 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/48

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

公开(公告)号：US11024981B2

公开(公告)日：2021-06-01

申请号：US16378281

申请日：2019-04-08

Applicant: MediaTek Inc.

Inventor： Chung-Hsin Chiang ,  Yeh-Chun Kao ,  Shih-Huang Yeh ,  Chen-Fang Tai

IPC: H01Q21/28 ,  H01Q9/18 ,  H01Q7/00 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q9/28 ,  H01Q9/16

Abstract: An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

公开(公告)号：US20190214741A1

公开(公告)日：2019-07-11

申请号：US16240795

申请日：2019-01-07

Applicant: MEDIATEK INC.

Inventor： Chung-Hsin Chiang ,  Yeh-Chun Kao ,  Shih-Huang Yeh

IPC: H01Q21/06 ,  H01Q21/24 ,  H01Q7/00

CPC classification number: H01Q21/062 ,  H01Q7/00 ,  H01Q21/24

Abstract: An antenna device includes a first dipole antenna, a second loop shaped antenna, a first feed line and a second feed line. The first dipole antenna operates at a first frequency band. The first dipole antenna includes a first portion and a second portion. The second loop shaped antenna operates at a second frequency band different from the first frequency band. A first terminal of the second loop shaped antennal is coupled to a second terminal of the first portion of the first dipole antenna. A second terminal of the second loop shaped antenna is coupled to a first terminal of the second portion of the first dipole antenna. The first feed line is coupled to the second terminal of the first portion of the first dipole antenna. The second feed line is coupled to the first terminal of the second portion of the first dipole antenna.