Invention Grant
- Patent Title: Bonding resistance and electromagnetic interference management of a surface mounted connector
-
Application No.: US17104143Application Date: 2020-11-25
-
Publication No.: US11581689B2Publication Date: 2023-02-14
- Inventor: Gregory Kopansky , Michael Joseph Schneider
- Applicant: Eaton Intelligent Power Limited
- Applicant Address: IE Dublin
- Assignee: Eaton Intelligent Power Limited
- Current Assignee: Eaton Intelligent Power Limited
- Current Assignee Address: IE Dublin
- Agency: Merchant & Gould P.C.
- Main IPC: H01R3/00
- IPC: H01R3/00 ; H01R43/02 ; H01R13/6584

Abstract:
A first component, such as an electrical connector, can be mechanically connected to a second component, such as a surface, and separately electrically bonded to the second component using a third component, such as foil. The third component can be ultrasonically welded to the first component and separately ultrasonically welded to the second component. In some cases, multiple third components can be utilized to cover a seam between the first and second components.
Public/Granted literature
- US20210159655A1 BONDING RESISTANCE AND ELECTROMAGNETIC INTERFERENCE MANAGEMENT OF A SURFACE MOUNTED CONNECTOR Public/Granted day:2021-05-27
Information query