Invention Grant
- Patent Title: Chip carrier device
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Application No.: US16998266Application Date: 2020-08-20
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Publication No.: US11587808B2Publication Date: 2023-02-21
- Inventor: Shih-Chun Chen , Sheng-Tou Tseng , Kun-Chi Hsu , Chin-Ta Wu , Ying-Lin Chen , Ting-Yeh Wu
- Applicant: Powertech Technology Inc.
- Applicant Address: TW Hsinchu
- Assignee: Powertech Technology Inc.
- Current Assignee: Powertech Technology Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Burris Law, PLLC
- Priority: TW109100964 20200110
- Main IPC: H01L21/673
- IPC: H01L21/673 ; C23C14/56
Abstract:
A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.
Public/Granted literature
- US20210217641A1 CHIP CARRIER DEVICE Public/Granted day:2021-07-15
Information query
IPC分类:
