Invention Grant
- Patent Title: Semiconductor device package
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Application No.: US16809500Application Date: 2020-03-04
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Publication No.: US11594660B2Publication Date: 2023-02-28
- Inventor: Tang-Yuan Chen , Meng-Wei Hsieh , Cheng-Yuan Kung
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L33/14
- IPC: H01L33/14 ; H01L33/00 ; H01L33/26
Abstract:
A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.
Public/Granted literature
- US20210280744A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-09-09
Information query
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