Provided are a polyimide film capable of reducing a dielectric constant of a substrate and reducing a thickness and forming a stable via with a low possibility of disconnection, a method for manufacturing the same, and an FPCB including the same. A polyimide film according to an exemplary embodiment of the present invention includes a polyimide layer and a plurality of fluororesin particles dispersed in the polyimide layer. The fluororesin particles have a spherical or flat shape.