Invention Grant
- Patent Title: Dual heat transfer structure
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Application No.: US16849973Application Date: 2020-04-15
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Publication No.: US11598584B2Publication Date: 2023-03-07
- Inventor: Sheng-Huang Lin
- Applicant: ASIA VITAL COMPONENTS CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Jackson IPG PLLC
- Agent Demian K. Jackson
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02 ; F28D15/04

Abstract:
A dual heat transfer structure, comprising: at least a heat pipe and at least a vapor chamber; the heat pipe having a first end, an extension portion, and a second end, the first and second ends disposed at the two ends of the extension portion; the vapor chamber being concavely bent with its two ends being joined together and selectively compasses, encircles, encloses, or surrounds one of the first and second ends and extension portion. The dual heat transfer structure of the present invention is a complex structure that can both transfer heat with a large area and to the distal end of the structure.
Public/Granted literature
- US20210325120A1 DUAL HEAT TRANSFER STRUCTURE Public/Granted day:2021-10-21
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