A heat dissipation device for an electronics cooling system having an electronic component includes a housing that defines a chamber. The device further includes a first liquid, which is contained within the chamber and has a first boiling temperature. The device further includes a sorbent material immersed within the first liquid. The device further includes a second liquid, which is adsorbed by the sorbent material and has a second boiling temperature that is above the first boiling temperature. The first liquid vaporizes into a first vapor, in response to the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material, in response to the second liquid and the sorbent material reaching a desorption temperature that is below the second boiling temperature. The second liquid vaporizes into a second vapor, in response to the second liquid reaching the second boiling temperature.