Invention Grant
- Patent Title: Analysis apparatus and analysis method
-
Application No.: US16796473Application Date: 2020-02-20
-
Publication No.: US11607750B2Publication Date: 2023-03-21
- Inventor: Jiahong Wu , Yuji Yamada
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2019-111444 20190614
- Main IPC: B23K26/40
- IPC: B23K26/40 ; H01J49/04 ; G01B11/06 ; G01B17/02 ; H01J49/10 ; G01N1/44 ; G01B7/06 ; G01N1/04

Abstract:
According to one embodiment, an analysis apparatus includes a stage on which to place a sample, a light source, a film thickness measurement unit, and a controller. The light source generates a laser beam to irradiate the sample with the laser beam to cause vaporization of the sample. The film thickness measurer measures a thickness of the sample at a first position where the laser beam irradiates the sample. The controller controls at least one irradiation condition of the laser beam based on the measured thickness of the sample.
Information query
IPC分类: