Invention Grant
- Patent Title: Transmission-based temperature measurement of a workpiece in a thermal processing system
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Application No.: US17183992Application Date: 2021-02-24
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Publication No.: US11610824B2Publication Date: 2023-03-21
- Inventor: Michael Storek , Rolf Bremensdorfer , Markus Lieberer , Michael Yang
- Applicant: Mattson Technology, Inc. , Beijing E-Town Semiconductor Technology Co., Ltd.
- Applicant Address: US CA Fremont; CN Beijing
- Assignee: Mattson Technology, Inc.,Beijing E-Town Semiconductor Technology Co., Ltd.
- Current Assignee: Mattson Technology, Inc.,Beijing E-Town Semiconductor Technology Co., Ltd.
- Current Assignee Address: US CA Fremont; CN Beijing
- Agency: Dority & Manning, P.A.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01J5/04 ; H01L21/67

Abstract:
A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.
Public/Granted literature
- US20210272858A1 Transmission-Based Temperature Measurement of a Workpiece in a Thermal Processing System Public/Granted day:2021-09-02
Information query
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