Invention Grant
- Patent Title: Buried word line structure and manufacturing method thereof
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Application No.: US17389296Application Date: 2021-07-29
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Publication No.: US11610892B2Publication Date: 2023-03-21
- Inventor: Chang-Hung Lin
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: TW110100475 20210106
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/108

Abstract:
A buried word line structure, including a first isolation structure, a buried word line, a first barrier layer, a second barrier layer, a channel layer, and a second isolation structure, is provided. The first isolation structure is disposed in the substrate and has a trench. The buried word line is disposed on a bottom surface of the trench. The first barrier layer is disposed between the buried word line and a sidewall and the bottom surface of the trench. The second barrier layer covers a top surface of the buried word line and includes a main portion and an extension portion. The main portion is located on the buried word line, and the extension portion extends upward from periphery of the main portion. The channel layer is disposed on the first barrier layer and the second barrier layer. The second isolation structure is disposed on the channel layer.
Public/Granted literature
- US20220216211A1 BURIED WORD LINE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-07-07
Information query
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