Invention Grant
- Patent Title: Additive manufacturing of polishing pads
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Application No.: US16897184Application Date: 2020-06-09
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Publication No.: US11612978B2Publication Date: 2023-03-28
- Inventor: Uma Sridhar , Sivapackia Ganapathiappan , Ashwin Murugappan Chockalingam , Mayu Felicia Yamamura , Daniel Redfield , Rajeev Bajaj , Yingdong Luo , Nag B. Patibandla
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B33Y10/00 ; C09D11/101 ; C09D11/102 ; B33Y70/00 ; B29C64/112 ; B33Y80/00 ; H01L21/306 ; B29L31/00 ; B29K63/00 ; B29K75/00
Abstract:
Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
Public/Granted literature
- US20210379725A1 Additive Manufacturing of Polishing Pads Public/Granted day:2021-12-09
Information query
