Invention Grant
- Patent Title: Plasma processing apparatus and techniques
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Application No.: US17401870Application Date: 2021-08-13
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Publication No.: US11615945B2Publication Date: 2023-03-28
- Inventor: Vikram M. Bhosle , Christopher J. Leavitt , Guillermo Colom , Timothy J. Miller
- Applicant: APPLIED Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED Materials, Inc.
- Current Assignee: APPLIED Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: KDB Firm PLLC
- Main IPC: H01J37/00
- IPC: H01J37/00 ; H01J37/32 ; H01L21/265 ; C23C14/48 ; H01J37/317

Abstract:
An apparatus may include a main chamber, a substrate holder, disposed in a lower region of the main chamber, and defining a substrate region, as well as an RF applicator, disposed adjacent an upper region of the main chamber, to generate an upper plasma within the upper region. The apparatus may further include a central chamber structure, disposed in a central portion of the main chamber, where the central chamber structure is disposed to shield at least a portion of the substrate position from the upper plasma. The apparatus may include a bias source, electrically coupled between the central chamber structure and the substrate holder, to generate a glow discharge plasma in the central portion of the main chamber, wherein the substrate region faces the glow discharge region.
Public/Granted literature
- US20210375590A1 PLASMA PROCESSING APPARATUS AND TECHNIQUES Public/Granted day:2021-12-02
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