Invention Grant
- Patent Title: Substrate isolated VTFET devices
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Application No.: US16743922Application Date: 2020-01-15
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Publication No.: US11615992B2Publication Date: 2023-03-28
- Inventor: Eric Miller , Marc A. Bergendahl , Kangguo Cheng , John Sporre , Gauri Karve , Fee Li Lie
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Samuel Waldbaum
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L21/8238 ; H01L29/66 ; H01L29/78 ; H01L29/786

Abstract:
A method of forming vertical transport field effect transistor (VTFET) devices is provided. The method includes forming a plurality of vertical fins on an upper insulating layer of a dual insulator layer semiconductor-on-insulator (SeOI) substrate, and forming two masking blocks on the plurality of vertical fins, wherein a portion of a protective layer and a fin template on each of the plurality of vertical fins is exposed between the two masking blocks. The method further includes removing a portion of the upper insulating layer between the two masking blocks to form a first cavity beneath the plurality of vertical fins, and forming a first bottom source/drain in the first cavity below the plurality of vertical fins. The method further includes replacing the two masking blocks with a masking layer patterned to have two mask openings above portions of the upper insulating layer adjacent to the first bottom source/drain.
Public/Granted literature
- US20210217669A1 SUBSTRATE ISOLATED VTFET DEVICES Public/Granted day:2021-07-15
Information query
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