Invention Grant
- Patent Title: Integrated assemblies and methods forming integrated assemblies
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Application No.: US17236589Application Date: 2021-04-21
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Publication No.: US11616119B2Publication Date: 2023-03-28
- Inventor: Che-Chi Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L21/336 ; H01L49/02 ; H01L27/108

Abstract:
Some embodiments include an integrated assembly having a laterally-extending container-shaped first capacitor electrode, and having a laterally-extending container-shaped second capacitor electrode laterally offset from the first capacitor electrode. Capacitor dielectric material lines interior surfaces and exterior surfaces of the container-shaped first and second capacitor electrodes. A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends along the lined interior and exterior surfaces of the first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.
Public/Granted literature
- US20220344450A1 Integrated Assemblies and Methods Forming Integrated Assemblies Public/Granted day:2022-10-27
Information query
IPC分类: