Invention Grant
- Patent Title: High-speed core interconnect for multi-die programmable logic devices
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Application No.: US17408129Application Date: 2021-08-20
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Publication No.: US11621713B2Publication Date: 2023-04-04
- Inventor: Lai Guan Tang , Ankireddy Nalamalpu , Dheeraj Subbareddy
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder, P.C.
- Main IPC: H03K19/177
- IPC: H03K19/177 ; H01L25/065 ; H03K19/17704 ; H03K19/17724 ; H03K19/1776 ; H03K19/17736 ; G06F30/30 ; G06F30/32 ; G06F30/34
Abstract:
Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.
Public/Granted literature
- US20210384911A1 HIGH-SPEED CORE INTERCONNECT FOR MULTI-DIE PROGRAMMABLE LOGIC DEVICES Public/Granted day:2021-12-09
Information query
IPC分类:
