Invention Grant
- Patent Title: Method of applying conductive adhesive and manufacturing device using the same
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Application No.: US17327270Application Date: 2021-05-21
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Publication No.: US11626295B2Publication Date: 2023-04-11
- Inventor: Min-Hsun Hsieh
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; B23K3/06 ; B23K1/00
Abstract:
An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.
Public/Granted literature
- US20210280436A1 METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USING THE SAME Public/Granted day:2021-09-09
Information query
IPC分类:
