Invention Grant
- Patent Title: Cover for swing member of substrate processing apparatus, swing member of substrate processing apparatus, and substrate processing apparatus
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Application No.: US16907679Application Date: 2020-06-22
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Publication No.: US11626299B2Publication Date: 2023-04-11
- Inventor: Yoshitaka Kitagawa , Hisajiro Nakano , Tomoatsu Ishibashi
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2019-116348 20190624
- Main IPC: B08B3/04
- IPC: B08B3/04 ; H01L21/67
Abstract:
A cover for a swing member of a substrate processing apparatus includes an upper surface including a first groove, and a first side edge and a second side edge located respectively at both ends of the upper surface in the short-length direction of the cover, where a bottom portion of the first groove is located lower than the first side edge and the second side edge.
Information query
IPC分类:
