Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17185443Application Date: 2021-02-25
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Publication No.: US11631613B2Publication Date: 2023-04-18
- Inventor: Chih-Kai Hsu , Ssu-I Fu , Chia-Jung Hsu , Chun-Ya Chiu , Chin-Hung Chen , Yu-Hsiang Lin
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: CN201910743194.7 20190813
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/768 ; H01L27/108

Abstract:
Provided is a semiconductor device, including a substrate including a pixel region, a gate structure on the substrate in the pixel region, wherein the gate structure comprises a gate dielectric layer and a gate conductive layer on the gate dielectric layer; a dielectric layer located over the substrate and the gate structure; and a contact located in the dielectric layer and electrically connected to the gate conductive layer. The contact includes a doped polysilicon layer in contact with the gate conductive layer; a metal layer located on the doped polysilicon layer, wherein a part of the metal layer is embedded in the doped polysilicon layer; a barrier layer located between the metal layer and the doped polysilicon layer; and a metal silicide layer located between the barrier layer and the doped polysilicon layer.
Public/Granted literature
- US20210202308A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-07-01
Information query
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