Invention Grant
- Patent Title: Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same
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Application No.: US17249325Application Date: 2021-02-26
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Publication No.: US11631628B2Publication Date: 2023-04-18
- Inventor: Christian Neugirg , Peter Scherl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L23/373 ; H01L21/50 ; H01L25/07 ; H01L23/495 ; H01L23/31 ; H01L23/433 ; H01L25/18
Abstract:
A semiconductor chip package is provided with improved connections between different components within the package. The semiconductor chip package may comprise a semiconductor chip disposed on a substrate. The semiconductor chip may have a first surface and a second surface. The first surface of the semiconductor chip may be connected to the substrate. The semiconductor chip package may comprise a leadframe that includes a first lead and a second lead. The first lead of the leadframe may be directly attached to the second surface of the semiconductor chip. The second lead of the leadframe may be directly attached to the substrate.
Public/Granted literature
Information query
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