Invention Grant
- Patent Title: Ferroelectric field effect transistors (FeFETs) having band-engineered interface layer
-
Application No.: US16616373Application Date: 2017-06-20
-
Publication No.: US11640995B2Publication Date: 2023-05-02
- Inventor: Prashant Majhi , Brian S. Doyle , Kevin P. O'Brien , Abhishek A. Sharma , Elijah V. Karpov , Kaan Oguz
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- International Application: PCT/US2017/038387 WO 20170620
- International Announcement: WO2018/236361 WO 20181227
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/24 ; H01L29/06 ; H01L29/51 ; H01L21/28 ; H01L27/22 ; H01L29/423 ; H01L29/49 ; H01L29/66 ; H01L29/786

Abstract:
Ferroelectric field effect transistors (FeFETs) having band-engineered interface layers are described. In an example, an integrated circuit structure includes a semiconductor channel layer above a substrate. A metal oxide material is on the semiconductor channel layer, the metal oxide material having no net dipole. A ferroelectric oxide material is on the metal oxide material. A gate electrode is on the ferroelectric oxide material, the gate electrode having a first side and a second side opposite the first side. A first source/drain region is at the first side of the gate electrode, and a second source/drain region is at the second side of the gate electrode.
Information query
IPC分类: