Invention Grant
- Patent Title: Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
-
Application No.: US16133083Application Date: 2018-09-17
-
Publication No.: US11643544B2Publication Date: 2023-05-09
- Inventor: Chih-Wei Liao , Ju-Ming Huang , Guan-Syun Tseng
- Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
- Applicant Address: TW Chupei
- Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee Address: TW Chupei
- Agency: Greer, Burns & Crain, Ltd
- Priority: TW 7103998 2018.02.05
- Main IPC: C08L63/00
- IPC: C08L63/00 ; H05K1/03 ; C08K5/3492 ; C08K3/36 ; C08K3/22 ; C08K3/28 ; C08K5/00 ; C08J5/24 ; C08K5/42 ; C08K5/18
Abstract:
A resin composition is provided. The resin composition includes the following constituents:
(A) an epoxy resin;
(B) an amino group-containing hardener; and
(C) a compound of formula (I),
wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).
(A) an epoxy resin;
(B) an amino group-containing hardener; and
(C) a compound of formula (I),
wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).
Public/Granted literature
- US20190241733A1 RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME Public/Granted day:2019-08-08
Information query
