Invention Grant
- Patent Title: Testing interposer method and apparatus
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Application No.: US17147638Application Date: 2021-01-13
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Publication No.: US11644482B2Publication Date: 2023-05-09
- Inventor: Lee D. Whetsel
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Carl G. Peterson; Frank D. Cimino
- The original application number of the division: US16747055 2020.01.20
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/3185 ; G01R31/28 ; G01R31/3177 ; G01R31/26 ; B05C21/00 ; B44D3/12 ; H05K1/11 ; G01R1/16
Abstract:
The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.
Public/Granted literature
- US20210132111A1 TESTING INTERPOSER METHOD AND APPARATUS Public/Granted day:2021-05-06
Information query
