A removable electronics device and related pre-fabricated sensor assemblies having different sensor layouts are provided. The removable electronics module includes one or more processors, an inertial measurement unit, a first communication interface configured to communicatively couple the removable electronics device to one or more computing devices, a second communication interface configured to communicatively couple the removable electronics device to a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processor, the inertial measurement unit, the first communication interface, and the second communication interface. The housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to the plurality of contact pads of the second communication interface.