Invention Grant
- Patent Title: Method for analyzing overcutting defect of machining process
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Application No.: US17179093Application Date: 2021-02-18
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Publication No.: US11654522B2Publication Date: 2023-05-23
- Inventor: Chien-Chih Liao , Kuo-Hua Chou , Cheng-Wei Wang , Jen-Ji Wang
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Priority: TW 0100457 2021.01.06
- Main IPC: B23Q15/24
- IPC: B23Q15/24 ; B23Q17/22 ; B23Q17/20 ; G05B19/41 ; G05B19/402

Abstract:
A method for analyzing an overcutting defect of a machining process comprises steps as following. A machining code is executed to generate a cutting face, wherein the cutting face comprises a plurality of machining paths. A specified machining path is defined from the plurality of machining paths and a specified node is set on the specified machining path. A sectional plane passing through the specified node is calculated. A plurality of intersection points between the sectional plane and the other machining paths which are different from the specified machining path are obtained. A first adjacent intersection point a second adjacent intersection point are specified from the intersection points. A connection line located between the first adjacent intersection point and the second adjacent intersection point is obtained. A distance between the specified node and connection line is calculate and the distance is defined as an overcutting amount of the specified node.
Public/Granted literature
- US20220212304A1 METHOD FOR ANALYZING OVERCUTTING DEFECT OF MACHINING PROCESS Public/Granted day:2022-07-07
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