Invention Grant
- Patent Title: Resin substrate and method for manufacturing resin substrate
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Application No.: US17318265Application Date: 2021-05-12
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Publication No.: US11659652B2Publication Date: 2023-05-23
- Inventor: Ryosuke Takada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 2018223384 2018.11.29
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K1/14 ; H05K3/46 ; H01R12/62

Abstract:
A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.
Public/Granted literature
- US20210267045A1 RESIN SUBSTRATE AND METHOD FOR MANUFACTURING RESIN SUBSTRATE Public/Granted day:2021-08-26
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