Invention Grant
- Patent Title: Method and apparatus for repairing the mid-foot region via an intramedullary nail
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Application No.: US17143616Application Date: 2021-01-07
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Publication No.: US11666363B2Publication Date: 2023-06-06
- Inventor: William H. Simon
- Applicant: Howmedica Osteonics Corp.
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner David LLP
- Main IPC: A61B17/72
- IPC: A61B17/72 ; A61B17/84 ; A61B17/88 ; A61B17/68

Abstract:
A device, method, and system for treatment or fixation of a fractured, damaged, or deteriorating bone or bones in a mid-foot region. The device comprising an implant with both proximal and distal fastener holes, along with fastener slots in a central elongated body, for securing the implant to the appropriate osseous cortical structures of the foot. The method for treatment or fixation of fractured, damaged, or deteriorating bones in the medial column of the foot with use of a device such as an intramedullary nail that attaches to either the talus or first metatarsal bones to secure the medial cuneiform and navicular bones in place.
Public/Granted literature
- US20210128206A1 Method and Apparatus For Repairing The Mid-Foot Region Via An Intramedullary Nail Public/Granted day:2021-05-06
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