Invention Grant
- Patent Title: Parylene electret condenser microphone backplate
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Application No.: US17184338Application Date: 2021-02-24
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Publication No.: US11671763B2Publication Date: 2023-06-06
- Inventor: Benjamin Jay Grigg , Donald D. Noettl
- Applicant: Shure Acquisition Holdings, Inc.
- Applicant Address: US IL Niles
- Assignee: Shure Acquisition Holdings, Inc.
- Current Assignee: Shure Acquisition Holdings, Inc.
- Current Assignee Address: US IL Niles
- Agency: Banner & Witcoff, Ltd.
- Main IPC: H04R19/01
- IPC: H04R19/01 ; H04R1/04 ; H04R7/04 ; H04R19/04 ; H04R31/00 ; B05D1/00
Abstract:
A microphone assembly comprising a housing, a single flexible diaphragm, and a rigid backplate. The backplate may be coated with a parylene configured to help reduce the flatness deviation of the backplate across the diameter of the backplate. A plurality of openings may extend from the top portion of the backplate to the bottom portion of the backplate.
Public/Granted literature
- US20220272460A1 PARYLENE ELECTRET CONDENSER MICROPHONE BACKPLATE Public/Granted day:2022-08-25
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