Invention Grant
- Patent Title: Methods of incorporating leaker devices into capacitor configurations to reduce cell disturb, and capacitor configurations incorporating leaker devices
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Application No.: US16933134Application Date: 2020-07-20
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Publication No.: US11672128B2Publication Date: 2023-06-06
- Inventor: Marcello Mariani , Giorgio Servalli
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/11507
- IPC: H01L27/11507 ; H01L49/02 ; H01L27/11504 ; H01L23/60
Abstract:
Some embodiments include an integrated assembly having a row of conductive posts. The conductive posts are spaced from one another by gaps. Leaker device material extends is within at least some of the gaps. An insulative material is along sidewalls of the conductive posts. A conductive structure is over the conductive posts. The conductive structure has downward projections extending into at least some of the gaps. The leaker device material is configured as segments along sides of the downward projections and extends from the sides to one or more of the conductive posts. Some embodiments include methods of forming integrated assemblies.
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