Invention Grant
- Patent Title: Retaining ring for CMP
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Application No.: US16435302Application Date: 2019-06-07
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Publication No.: US11673226B2Publication Date: 2023-06-13
- Inventor: Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/32
- IPC: B24B37/32 ; H01L21/306 ; H01L21/67 ; H01L21/687

Abstract:
A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.
Public/Granted literature
- US20190291238A1 RETAINING RING FOR CMP Public/Granted day:2019-09-26
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