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公开(公告)号:US20190291238A1
公开(公告)日:2019-09-26
申请号:US16435302
申请日:2019-06-07
Applicant: Applied Materials, Inc.
Inventor: Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum, JR. , Wei-Cheng Lee , Jeonghoon Oh
IPC: B24B37/32 , H01L21/687 , H01L21/67 , H01L21/306
Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.
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公开(公告)号:US11673226B2
公开(公告)日:2023-06-13
申请号:US16435302
申请日:2019-06-07
Applicant: Applied Materials, Inc.
Inventor: Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
IPC: B24B37/32 , H01L21/306 , H01L21/67 , H01L21/687
CPC classification number: B24B37/32 , H01L21/30625 , H01L21/67063 , H01L21/67092 , H01L21/68735
Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.
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公开(公告)号:US10434623B2
公开(公告)日:2019-10-08
申请号:US15456320
申请日:2017-03-10
Applicant: Applied Materials, Inc.
Inventor: Eric Lau , Hui Chen , King Yi Heung , Wei-Cheng Lee , Chih Chung Chou , Edwin C. Suarez , Garrett Ho Yee Sin , Charles C. Garretson , Jeonghoon Oh
Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.
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公开(公告)号:US10322492B2
公开(公告)日:2019-06-18
申请号:US15658294
申请日:2017-07-24
Applicant: Applied Materials, Inc.
Inventor: Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
IPC: B24B37/32 , H01L21/306 , H01L21/67 , H01L21/687
Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.
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