Invention Grant
- Patent Title: Devices for fabrication of shielded modules
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Application No.: US16231456Application Date: 2018-12-22
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Publication No.: US11682585B2Publication Date: 2023-06-20
- Inventor: Yi Liu , Anthony James Lobianco , Matthew Sean Read , Hoang Mong Nguyen , Howard E. Chen
- Applicant: SKYWORKS SOLUTIONS, INC.
- Applicant Address: US MA Woburn
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Chang & Hale LLP
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/3205 ; H01L23/552 ; H01L23/00 ; H01L23/31 ; B23K26/38
Abstract:
Devices for fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.
Public/Granted literature
- US20190214300A1 DEVICES FOR FABRICATION OF SHIELDED MODULES Public/Granted day:2019-07-11
Information query
IPC分类:
