Invention Grant
- Patent Title: Multilayer coil and method for manufacturing the same
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Application No.: US16257156Application Date: 2019-01-25
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Publication No.: US11688553B2Publication Date: 2023-06-27
- Inventor: Kanto Iida , Naoki Gouchi , Shingo Ito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 16160540 2016.08.18
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K1/16 ; H05K1/18 ; H05K3/00 ; H05K3/30 ; H05K3/36 ; H05K3/46 ; H01F5/00 ; H01F17/00 ; H01F17/06 ; H01F41/04 ; H04R9/02 ; H04R9/06 ; H01F17/02 ; C09K19/38 ; H05K1/02

Abstract:
A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.
Public/Granted literature
- US20190157001A1 MULTILAYER COIL AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-05-23
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