Invention Grant
- Patent Title: Semiconductor chip with local oscillator buffer reused for signal transmission and associated transmission method
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Application No.: US17505605Application Date: 2021-10-19
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Publication No.: US11695439B2Publication Date: 2023-07-04
- Inventor: Jui-Lin Hsu , Yen-Tso Chen , Hsiang-Yun Chu , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H04B1/48 ; H04B1/08 ; H01L23/66 ; H04W92/00

Abstract:
A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.
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