Invention Grant
- Patent Title: Polyamide-imide film and method for preparing same
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Application No.: US16477697Application Date: 2018-02-05
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Publication No.: US11702519B2Publication Date: 2023-07-18
- Inventor: Dawoo Jeong , Sunhwan Kim , Jin Woo Lee , Dae Seong Oh , Dong Jin Lim
- Applicant: SK microworks Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: SKC microworks CO., LTD.
- Current Assignee: SKC microworks CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR 20170017550 2017.02.08 KR 20170121939 2017.09.21
- International Application: PCT/KR2018/001498 2018.02.05
- International Announcement: WO2018/147606A 2018.08.16
- Date entered country: 2019-07-12
- Main IPC: C08J5/18
- IPC: C08J5/18 ; C08G73/14 ; B29C39/24 ; B29C39/38 ; B29C39/42 ; B29C39/44 ; C08G73/10 ; C08L79/08 ; B29C41/00 ; B29K77/00 ; B29K105/00

Abstract:
An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.
Information query