公开(公告)号：US12037473B2

公开(公告)日：2024-07-16

申请号：US17862476

申请日：2022-07-12

Applicant: SK microworks Co., Ltd.

Inventor： Dae Seong Oh ,  Dawoo Jeong ,  Sunhwan Kim ,  Jin Woo Lee ,  Dong Jin Lim ,  Kyungeun Oh

IPC: C08G73/10 ,  B29C39/24 ,  B29C39/38 ,  B29C39/42 ,  B29C39/44 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  B29C41/00 ,  B29K77/00 ,  B29K105/00

CPC classification number: C08J5/18 ,  B29C39/24 ,  B29C39/38 ,  B29C39/42 ,  B29C39/44 ,  C08G73/1039 ,  C08G73/14 ,  C08L79/08 ,  B29C41/003 ,  B29K2077/00 ,  B29K2105/0094 ,  C08J2379/08 ,  C08L2201/10 ,  C08L2203/16

Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2θ=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2θ=23° with respect to a peak area seen around 2θ=15°.

公开(公告)号：US11873372B2

公开(公告)日：2024-01-16

申请号：US16912942

申请日：2020-06-26

Applicant: SK microworks Co., Ltd.

Inventor： Han Jun Kim ,  Sunhwan Kim ,  Dae Seong Oh ,  Jin Woo Lee ,  Sang Hun Choi ,  Jung Hee Ki ,  Dong Jin Lim

IPC: C08G73/14 ,  C08J5/18 ,  C08K3/26 ,  C08K3/105 ,  C08K3/16

CPC classification number: C08G73/14 ,  C08J5/18 ,  C08K3/105 ,  C08K3/16 ,  C08K3/26 ,  C08J2379/08 ,  C08K2003/262

Abstract: Embodiments relate to a polyamide-imide film that maintains its mechanical properties at least at a certain level under the conditions of high temperatures and low temperatures and is excellent in transparency and folding characteristics, a process for preparing the same, and a cover window comprising the same. The polyamide-imide film comprises a polyamide-imide polymer and has an MOR value defined in Equation 1a of 75% or more.

公开(公告)号：US11780965B2

公开(公告)日：2023-10-10

申请号：US17667225

申请日：2022-02-08

Applicant: SK microworks Co., Ltd.

Inventor： Dawoo Jeong ,  Sunhwan Kim ,  Dae Seong Oh ,  Jin Woo Lee ,  Dong Jin Lim

IPC: C08G73/14 ,  C08J5/18 ,  C08G73/10 ,  B29C39/00 ,  B29C39/14 ,  B29C39/38 ,  B29K79/00 ,  B29L7/00

CPC classification number: C08G73/14 ,  B29C39/003 ,  B29C39/14 ,  B29C39/38 ,  C08G73/1032 ,  C08J5/18 ,  B29K2079/085 ,  B29L2007/008 ,  C08J2379/08

Abstract: Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.

公开(公告)号：US11702519B2

公开(公告)日：2023-07-18

申请号：US16477697

申请日：2018-02-05

Applicant: SK microworks Co., Ltd.

Inventor： Dawoo Jeong ,  Sunhwan Kim ,  Jin Woo Lee ,  Dae Seong Oh ,  Dong Jin Lim

IPC: C08J5/18 ,  C08G73/14 ,  B29C39/24 ,  B29C39/38 ,  B29C39/42 ,  B29C39/44 ,  C08G73/10 ,  C08L79/08 ,  B29C41/00 ,  B29K77/00 ,  B29K105/00

CPC classification number: C08J5/18 ,  B29C39/24 ,  B29C39/38 ,  B29C39/42 ,  B29C39/44 ,  C08G73/1039 ,  C08G73/14 ,  C08L79/08 ,  B29C41/003 ,  B29K2077/00 ,  B29K2105/0094 ,  C08J2379/08 ,  C08L2201/10 ,  C08L2203/16

Abstract: An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.

公开(公告)号：US11970613B2

公开(公告)日：2024-04-30

申请号：US16913245

申请日：2020-06-26

Applicant: SK microworks Co., Ltd.

Inventor： Jung Hee Ki ,  Sunhwan Kim ,  Sang Hun Choi ,  Dae Seong Oh ,  Han Jun Kim ,  Jin Woo Lee ,  Dong Jin Lim

IPC: C08L79/08 ,  C08G73/10 ,  C08K5/09 ,  C09K11/02

CPC classification number: C08L79/08 ,  C08G73/1007 ,  C08K5/09 ,  C08L2201/10 ,  C08L2203/16 ,  C09K11/025

Abstract: Embodiments relate to a polymer film. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has a haze (HZ0) before autoclave treatment of 3% or less and a ΔHZ24 represented by Equation 1a of 500% or less.