Invention Grant
- Patent Title: Current sense multi-chip module
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Application No.: US17339502Application Date: 2021-06-04
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Publication No.: US11703544B2Publication Date: 2023-07-18
- Inventor: Gary S. Bolotin , Don J. Hunter , Malcolm L. Lias , Ben Cheng , John J. Waters , Sunant Katanyoutanant
- Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Applicant Address: US CA Pasadena
- Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee Address: US CA Pasadena
- Agency: Steinfl + Bruno LLP
- Main IPC: G01R31/34
- IPC: G01R31/34 ; H02P29/60 ; G01R19/32 ; B64G1/66 ; G01R19/22

Abstract:
Current sensing devices that are capable of surviving harsh ambient environment of ocean worlds, such as Jupiter and Saturn moons are disclosed. The described devices can meet 300 Krad radiation requirements and can survive at cold temperatures down to −184° C. Exemplary implementations of the constituent circuits of the devices are presented. A scheduling algorithm to perform various measurement by the disclosed current sensing devices is also described.
Public/Granted literature
- US20210389377A1 CURRENT SENSE MULTI-CHIP MODULE Public/Granted day:2021-12-16
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