- Patent Title: Connection structure between sensor and cable, and connection cable
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Application No.: US17000775Application Date: 2020-08-24
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Publication No.: US11705646B2Publication Date: 2023-07-18
- Inventor: Hiroyuki Tanaka
- Applicant: HIRAKAWA HEWTECH CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HIRAKAWA HEWTECH CORPORATION
- Current Assignee: HIRAKAWA HEWTECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McGinn I.P. Law Group, PLLC
- Priority: JP 19155771 2019.08.28
- Main IPC: G01J1/44
- IPC: G01J1/44 ; H01R4/02 ; H01R4/04

Abstract:
A connection structure between sensor and cable includes a cable formed by assembling a plurality of electric wires each including a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion, a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other, and a sensor that detects a physical quantity, and the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer.
Public/Granted literature
- US20210066820A1 CONNECTION STRUCTURE BETWEEN SENSOR AND CABLE, AND CONNECTION CABLE Public/Granted day:2021-03-04
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