Invention Grant
- Patent Title: Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
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Application No.: US16919065Application Date: 2020-07-01
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Publication No.: US11706516B2Publication Date: 2023-07-18
- Inventor: Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Zhejiang
- Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee Address: CN Zhejiang
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: CN 1610142925.9 2016.03.12 CN 1610143457.7 2016.03.12 CN 1610148338.0 2016.03.15 CN 1610149444.0 2016.03.15
- The original application number of the division: US15075192 2016.03.20
- Main IPC: H04N23/57
- IPC: H04N23/57 ; H01L27/146 ; H04N13/239 ; H04N23/45 ; H04N23/51 ; H04N23/54 ; H04N23/55
Abstract:
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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