Invention Grant
- Patent Title: Pattern shape evaluation device, pattern shape evaluation system, and pattern shape evaluation method
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Application No.: US17277395Application Date: 2019-05-29
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Publication No.: US11713963B2Publication Date: 2023-08-01
- Inventor: Atsuko Shintani , Takahiro Kawasaki , Kazuhisa Hasumi , Masami Ikota , Hiroki Kawada
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- Priority: JP 18178430 2018.09.25
- International Application: PCT/JP2019/021368 2019.05.29
- International Announcement: WO2020/066128A 2020.04.02
- Date entered country: 2021-03-18
- Main IPC: G01B15/04
- IPC: G01B15/04 ; G01B15/08 ; G01N23/2251 ; H01J37/28

Abstract:
Line-edge roughness or line width roughness is evaluated while preventing influence of noise caused by a device or an environment. Therefore, an averaged signal profile 405 in which a moving average of S pixels (S is an integer greater than 1) is taken in a Y direction is obtained from a signal profile showing a secondary electron signal amount distribution in an X direction with respect to a predetermined Y coordinate obtained from a top-down image, an edge position 406 of a line pattern is extracted based on the averaged signal profile, and a noise floor height is calculated based on a first power spectral density 407 of LER data or LWR data based on the extracted edge position and a second power spectral density 409 of a rectangular window function corresponding to the moving average of the S pixels.
Public/Granted literature
- US20220034653A1 PATTERN SHAPE EVALUATION DEVICE, PATTERN SHAPE EVALUATION SYSTEM, AND PATTERN SHAPE EVALUATION METHOD Public/Granted day:2022-02-03
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