Invention Grant
- Patent Title: Integrated sensor for multi-dimensional signal analysis
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Application No.: US17190331Application Date: 2021-03-02
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Publication No.: US11719639B2Publication Date: 2023-08-08
- Inventor: Gerard Schmid , Dajiang Yang , Eric A. G. Webster , Xin Wang , Todd Rearick , Changhoon Choi , Ali Kabiri , Kyle Preston , Brian Reed
- Applicant: Quantum-Si Incorporated
- Applicant Address: US CT Guilford
- Assignee: Quantum-Si Incorporated
- Current Assignee: Quantum-Si Incorporated
- Current Assignee Address: US CT Guilford
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: G01N21/64
- IPC: G01N21/64 ; H01L27/146

Abstract:
Some aspects relate to an integrated circuit, comprising at least one photodetection region configured to generate charge carriers responsive to incident photons emitted from a sample, at least one charge storage region configured to receive the charge carriers from the photodetection region, and at least one controller configured to obtain information about the incident photons, the information comprising at least one member selected from the group comprising pulse duration and interpulse duration and at least one member selected from the group comprising wavelength information, luminescence lifetime information, and intensity information. In some embodiments, the information comprises at least three, four, and/or five members selected from the group comprising wavelength information, luminescence lifetime information, intensity information, pulse duration information, and interpulse duration information. In some embodiments, the information obtained may be used to identify the sample.
Public/Granted literature
- US20210270740A1 INTEGRATED SENSOR FOR MULTI-DIMENSIONAL SIGNAL ANALYSIS Public/Granted day:2021-09-02
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