Invention Grant
- Patent Title: Extended cross-temperature handling in a memory sub-system
-
Application No.: US17516009Application Date: 2021-11-01
-
Publication No.: US11720286B2Publication Date: 2023-08-08
- Inventor: Vamsi Pavan Rayaprolu , Sampath K. Ratnam , Sivagnanam Parthasarathy , Mustafa N. Kaynak , Kishore Kumar Muchherla , Shane Nowell , Peter Feeley , Qisong Lin
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F3/06
Abstract:
An indication of a programming temperature at which data is written at a first location of the memory component is received. If it is indicated that the programming temperature is outside of a temperature range associated with the memory component, the data written to the first location of the memory component is re-written to a second location of the memory component when an operating temperature of the memory component returns within the temperature range.
Public/Granted literature
- US20220129204A1 EXTENDED CROSS-TEMPERATURE HANDLING IN A MEMORY SUB-SYSTEM Public/Granted day:2022-04-28
Information query
