Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17207727Application Date: 2021-03-21
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Publication No.: US11721720B2Publication Date: 2023-08-08
- Inventor: Tseng-Yao Pan , Chien-Hsiang Yu , Ching-Yung Wang , Cheng-Hong Wei , Ming-Tsang Wang
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/308
Abstract:
A semiconductor structure includes a trunk portion and a branch portion. The trunk portion extends in a first direction. The branch portion is connected to the trunk portion. The branch portion includes a handle portion and a two-pronged portion. The handle portion is connected to the trunk portion and extends in a second direction. The second direction intersects the first direction. The two-pronged portion is connected to the handle portion. A line width of the handle portion is greater than a line width of the two-pronged portion.
Public/Granted literature
- US20220302254A1 SEMICONDUCTOR STRUCTURE AND MANUFACURING METHOD THEREOF Public/Granted day:2022-09-22
Information query
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