Invention Grant
- Patent Title: Radio frequency module and communication apparatus
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Application No.: US17221845Application Date: 2021-04-05
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Publication No.: US11750158B2Publication Date: 2023-09-05
- Inventor: Kunitoshi Hanaoka , Kiyoshi Aikawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: XSENSUS LLP
- Priority: JP 20106478 2020.06.19
- Main IPC: H03F3/24
- IPC: H03F3/24 ; H03H9/46 ; H05K1/18 ; H04B1/40

Abstract:
A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.
Public/Granted literature
- US20210399699A1 RADIO FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2021-12-23
Information query
IPC分类: