公开(公告)号：US11626967B2

公开(公告)日：2023-04-11

申请号：US17314043

申请日：2021-05-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenji Tahara ,  Seikoh Ono ,  Kiyoshi Aikawa ,  Masanari Miura ,  Hiromichi Kitajima

IPC: H04J3/00 ,  H04L5/14 ,  H04B1/16

Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.

公开(公告)号：US11817358B2

公开(公告)日：2023-11-14

申请号：US17142611

申请日：2021-01-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi Aikawa ,  Takafumi Kusuyama

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/18 ,  H01L25/065 ,  H05K3/28 ,  H05K1/14 ,  H05K1/18 ,  H01L23/14

CPC classification number: H01L23/14 ,  H01L23/3107 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/66 ,  H01L25/18 ,  H01L2223/6688

Abstract: A circuit module includes a first wiring substrate having a first main surface and a plurality of first components mounted on the first main surface. The plurality of first components includes a multilayer component formed as a single chip by being sealed using resin members. The multilayer component includes a second wiring substrate having a second main surface and a third main surface that face each other, a second component mounted on the second main surface, and a third component mounted on the third main surface.

公开(公告)号：US10381989B2

公开(公告)日：2019-08-13

申请号：US16142079

申请日：2018-09-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi Aikawa

IPC: H04B1/06 ,  H04B1/10 ,  H04M1/00 ,  H03F1/56 ,  H04B1/18 ,  H03F3/189 ,  H04B1/00

Abstract: A high-frequency circuit includes a first signal path transmitting a high-frequency signal in a first frequency band group, a second signal path transmitting a high-frequency signal in a second frequency band group, a switch including a common terminal and selection terminals, a first low noise amplifier including an input terminal connected to the first signal path and an output terminal connected to a first selection terminal, a second low noise amplifier including an input terminal connected to the second signal path and an output terminal connected to a second selection terminal, and an output-side impedance matching circuit that matches impedance at the output side of the first low noise amplifier or impedance at the output side of the second low noise amplifier with a predetermined impedance with a conductive state between the a third selection terminal and the common terminal.

公开(公告)号：US11750158B2

公开(公告)日：2023-09-05

申请号：US17221845

申请日：2021-04-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kunitoshi Hanaoka ,  Kiyoshi Aikawa

IPC: H03F3/24 ,  H03H9/46 ,  H05K1/18 ,  H04B1/40

CPC classification number: H03F3/245 ,  H03H9/46 ,  H04B1/40 ,  H05K1/181 ,  H03F2200/451 ,  H05K2201/1006 ,  H05K2201/10151

Abstract: A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.

公开(公告)号：US10340959B2

公开(公告)日：2019-07-02

申请号：US16142081

申请日：2018-09-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi Aikawa

IPC: H04B1/16 ,  H04B1/00

Abstract: A front-end module includes a switch, a first filter including an input end connected to a first selection terminal, a second filter including input end connected to a second selection terminal, and an impedance matching circuit connected to a selection terminal, a pass band impedance when viewing the first filter side from a common terminal in a state in which the common terminal and only the first selection terminal are connected is different from a pass band impedance when viewing the second filter side from the common terminal in a state that the common terminal and only the second selection terminal are connected. When the common terminal and the first selection terminal are connected, the common terminal and the selection terminal are connected, and when the common terminal and the second selection terminal are connected, the common terminal and the selection terminal are not connected.