Invention Grant
- Patent Title: MRI shield
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Application No.: US17225632Application Date: 2021-04-08
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Publication No.: US11754650B2Publication Date: 2023-09-12
- Inventor: Mayur J. Thakore
- Applicant: Howmedica Osteonics Corp.
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner David LLP
- Main IPC: G01R33/422
- IPC: G01R33/422 ; A61B5/055

Abstract:
A multi-layered shielding apparatus for reducing the heating of an implanted device within a patient during an MRI scan is disclosed. The shield comprises four internal layers circumferentially surrounded by a waterproof fabric pouch for maintaining composure of the shield and providing a comfortable interface for the patient. The second layer is a thin high conductive energy permeable layer for absorbing a substantial amount of RF energy. The first and third layers are thick low conductive energy absorbent layers that surround the second layer to absorb the RF currents produced by the interaction between the RF energy and the high conductive layer. The fourth layer is a nonconductive polymer layer for insulating the human tissue from any RF currents produced among the other layers.
Public/Granted literature
- US20210318400A1 MRI Shield Public/Granted day:2021-10-14
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