- Patent Title: Beryllium copper alloy bonded body and production method therefor
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Application No.: US17646175Application Date: 2021-12-28
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Publication No.: US11761071B2Publication Date: 2023-09-19
- Inventor: Takahiro Ishikawa , Takenori Ichigi , Tsutomu Otaki
- Applicant: NGK INSULATORS, LTD. , TATSUNO CORPORATION
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.,Tatsuno Corporation
- Current Assignee: NGK INSULATORS, LTD.,Tatsuno Corporation
- Current Assignee Address: JP Nagoya; JP Tokyo
- Agency: BURR PATENT LAW, PLLC
- Priority: JP 19125307 2019.07.04
- Main IPC: C22F1/08
- IPC: C22F1/08 ; B23K20/02 ; B32B15/01 ; C22C9/00 ; C25D3/12 ; C25D5/50 ; B23K103/12
Abstract:
Provided is a beryllium copper alloy bonded body including a first member made of a beryllium copper alloy and a second member made of a beryllium copper alloy, wherein the first member and the second member are bonded to each other via the nickel layer having a thickness of 8 μm or less.
Public/Granted literature
- US20220119930A1 BERYLLIUM COPPER ALLOY BONDED BODY AND PRODUCTION METHOD THEREFOR Public/Granted day:2022-04-21
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