Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having nanowires with tight vertical spacing
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Application No.: US16405807Application Date: 2019-05-07
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Publication No.: US11769836B2Publication Date: 2023-09-26
- Inventor: Glenn Glass , Anand Murthy , Biswajeet Guha , Tahir Ghani , Susmita Ghose , Zachary Geiger
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/06 ; H01L29/08 ; H01L29/423

Abstract:
Gate-all-around integrated circuit structures having nanowires with tight vertical spacing, and methods of fabricating gate-all-around integrated circuit structures having nanowires with tight vertical spacing, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal silicon nanowires. A vertical spacing between vertically adjacent silicon nanowires is less than 6 nanometers. A gate stack is around the vertical arrangement of horizontal silicon nanowires. A first source or drain structure is at a first end of the vertical arrangement of horizontal silicon nanowires, and a second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal silicon nanowires.
Information query
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