- Patent Title: Resistive random access memory and method of fabricating the same
-
Application No.: US17027700Application Date: 2020-09-21
-
Publication No.: US11770985B2Publication Date: 2023-09-26
- Inventor: Po-Yen Hsu , Bo-Lun Wu , Shih-Ning Tsai
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H10B63/00 ; H10N70/20

Abstract:
Provided is a resistive random access memory (RRAM) including a first electrode layer and a second electrode layer disposed opposite to each other, a variable resistance layer located between the first electrode layer and the second electrode layer, an oxygen exchange layer located between the variable resistance layer and the second electrode layer, a conductive layer laterally surrounding a sidewall of the oxygen exchange layer, a first barrier layer located between the conductive layer and the oxygen exchange layer and between the oxygen exchange layer and the variable resistance layer, and a second barrier layer located between the conductive layer and the second electrode layer and between the second electrode layer and the oxygen exchange layer.
Public/Granted literature
- US20220093858A1 RESISTIVE RANDOM ACCESS MEMORY AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-03-24
Information query